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Otmel Electronic components

  • FPGA
  • DSP
  • ADC
  • Power
  • RF
  • Memory
  • MCU
  • CPU
  • Timing

Production and development process

From your first requirement to final delivery, a clear process connects every stage of your project.

  1. Customer demand
  2. Technical scheme
  3. Design implementation
  4. Prototype test
  5. Engineering pilot run
  6. Deliver to customers

Product center

LNA integrated circuit package illustration

LNA

Low-noise amplifiers

RF components for sensitive signal reception. Talk to our team about your application.

AC-DC integrated circuit package illustration

AC-DC

Power conversion

Power solutions for your next design. Share your voltage, power and package requirements.

16-bit integrated circuit package illustration

16-bit

Signal processing

Precision components for connected systems. Find support for your component selection.

High performance integrated circuit package illustration

High performance

Integrated circuits

Components for demanding applications. Contact us for model availability and sourcing.

About Us

Contact Us

12/F, Block A, Mai Hing Industrial Building, 16–18 Hing Yip Street, Kwun Tong, Kowloon, Hong Kong
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